Edsyn SSC8250 Solder, lead-free
With continuous flux core, the NO-CLEAN solution, with fluxing agent according to F-SW 32 Also suitable for slightly soiled or oxidized pads Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 32 Flux …
With continuous flux core, the NO-CLEAN solution, with fluxing agent according to F-SW 32 Also suitable for slightly soiled or oxidized pads Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 32 Flux …
EDSYN SSC8250 lead-free solder wire with tin-copper and NO-Clean flux
With continuous flux core, the NO-CLEAN solution, with fluxing agent according to F-SW 32
Also suitable for slightly soiled or oxidized pads
Copper content makes copper pads on the printed circuit board easier to process
Sn99 Cu1 with F-SW 32
Flux residues are transparent
Melting point: * Solidus: 227°C.
Liquidus: 227°C.
This text is machine translated.
Highlights & Details
- Sn99Cu1 with F-SW32
Facts
- 250g coil
- With a diameter
- of 0.8mm
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