3DXSTAT™ ESD-SAFE PLA 3D FILAMENT FROM 3DXTECH™
3DXSTAT ™ ESD PLA is an advanced ESD-safe connection designed for use in critical applications requiring electrostatic discharge protection (ESD). Made using state-of-the-art multi-wall carbon nanotube technology, state-of-the-art compounding technology and precise extrusion processes. Target surface resistance: 10 ^ 7 to 10 ^ 9 ohms.
Typical uses are:
Semi-con: Hard disk components, enclosures, wafer handling, fixtures, housings and connectors
Industrial: Devices, conveying, dosing, tools at the end of the arm and sensor applications
Target conductivity for 3XSTAT ESD PLA
Specification: 10 ^ 6 to 10 ^ 9 ohms surface resistance on a 3DP sample using the concentric ring method, target 10 ^ 7 ohms
Note: Internal studies have shown that elevated extruder temperatures can achieve a higher conductivity. Similarly, lower extruder temperatures have resulted in lower conductivity. Each printer is set up differently and has a different part geometry. So expect some testing time to understand how this filament works in your specific printer/application.
Surface conductivity as a function of the extruder temperature
The surface resistance of the printed ESD-safe part depends on the extruder temperature of the printer. For example, if your tests show that the part is too insulating, increasing the extruder temperature will improve conductivity. Therefore, the surface resistance can be "selected" by adjusting the extruder temperature up or down depending on the measured value you get from your side.
This text is machine translated.