
Asus PRIME B860M-A-CSM Motherboard
Highlights & Details
- Supports Intel Core Ultra 2 series processors
- Fitted with four DIMM slots for DDR5 RAM with O.C. Speeds up to 4333 MHz
- Multiple USB connectivity options including USB-C 3.2 Gen 2x2
- High-definition audio with 8-channel output
- RAID support for improved storage management
Technical specifications
- RAM bus frequency 4333 MHz (O.C.)
- Supported RAM integrity check: Non-ECC, on-the-ECC
- RAM Registered or buffered: Unbuffered
- RAM Special features: Intel Extreme Memory Profile (XMP), two-channel memory architecture
- Type HD Audio (8-channel)
- Audio compatibility: High-definition audio
- Network interfaces 2.5 Gigabit Ethernet
- Expansion slots: 1 x CPU, 4 x DIMM 288-pin, 1 x PCIe 5.0 x16, 1 x PCIe 4.0 x16 (x4 mode), 3 x PCIe 4.0 x16 (1x mode), 1 x M.2 slot (2242/2260/2280 M.2 slot with key M), 1 x M.2 socket (2242/2260/2280/22110 M.2 slot with key M)
- Memory interfaces: SATA-600 interface points: 4 x 7-pin serial ATA - RAID 0 / RAID 1 / RAID 10 / RAID 5, PCIe 4.0 connection points: 1 x M.2, PCIe 5.0 connection points: 1 x M.2
- External interfaces: 1 x HDMI, 1 x DisplayPort, 1 x USB 3.2 Gen 1, 4 x USB 2.0, 2 x USB 3.2 Gen 2, 1 x USB-C 3.2 Gen2, 2 x Antenna, 1 x LAN (2.5Gigabit Ethernet), 1 x Microphone - Mini jack plug, 1 x audio line in – mini jack plug, 1 x audio line out – mini jack plug
- Internal interfaces: 1 x USB-C 3.2 Gen 1 - multi-pin connector, 2 x USB 2.0 Gen 1 - multi-pin connector, 1 x USB 3.2 - multi-pin connector, 1 x serial pin connector, 2 x audio - multi-pin connector, 1 x SPDIF-output - multi-pin connector, 1 x Thunderbolt 4 - multi-pin connector, 1 x SPI - multi-pin connector
- Power connections: Main power connection, 24-pin, ATX12V plug, 8-pin
- BIOS type: AMI
- BIOS functions: UEFI BIOS, Asus EZ Flash, Asus UEFI BIOS EZ Mode
- Sleep / Wake -up: Wake-On-LAN (WOL), Wake On PME
- Hardware features: Preboot execution environment (PXE), Asus 5X protection III, Asus DIGI+ VRM, LANguard, over-voltage protection, Asus Safeslot core, Asus stainless steel back I/O, Asus Q design, Q antenna, Q dashboard, Q-DIMM, Q-LED core, Q-slot, M.2 heat sink, VRM heat sink design, Asus EZ DIY, Asus ProCool, 8+1+1+1 Phase Power design, Asus Enhanced Memory Profile (AEMP) III, Asus Aura Sync, Dr.MOS MOSFET, 6 Layer PCB, Asus fan Xpert 2+
- Product type
Motherboard
- Chipset
Intel® B860
#####Intel® 1851
- Form factor
ATX
- Processor/type
(unterstützt Intel Core Ultra Prozessoren (Serie 2))
- RAM type
DDR5 RAM
- Clock speed
4333 MHz
- RAM / Max. upgrade
256 GB
- Interfaces
HDMI™
DisplayPort
USB A (USB 3.2 1st gen)
USB A (USB 2.0)
USB A (USB 3.2 2nd gen)
USB C® (USB 3.2 2x 2nd gen)
Antenna (75 Ohm)
Gigabit LAN (1/2.5 Gbps)
Microphone input
Audio line in
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- No. of DDR5 slots
4 x
- No. of Gigabit LANs
1 x
- No. of PCIe 3.0 x16
4 x
- No. of PCIe 3.0 x16
1 x
- No. of USB 2.0 ports
4 x
- No. of USB 3.2 2nd Gen (USB 3.1)
2 x
- No. of USB 3.2
1 x
- No. of USB 3.0 ports
1 x
- No. of SATA III ports
4 x
- Factory colour
Multicolour
- Depth
244 mm
- Height
50 mm
- Width
244 mm
- No. of DisplayPort
2 x
- No. of HDMI ports
1 x
- No. of USB A 2.0 ports
4 x
- No. of USB type A 3.1 / 3.2 1st Gen
2 x
- No of. USB type A 3.1 /3.2 2nd gen
1 x
- Range of use
PC
- Weight
815 g
- Wi-Fi
No
- UKCA
yes
- BIOS memory size
256 Mbit
- Line-in
yes
- Ethernet LAN
yes
- Number of memory slots
4
- Thunderbolt headers
1
- USB 3.2 Gen 2 (3.1 Gen 2) connectors
1
- Microphone in
yes
- 12V power connector
yes
- S/PDIF out connector
yes
- CPU fan connector
yes
- ATX Power connector (24-pin)
yes
- Chassis intrusion connector
yes
- Front panel audio connector
yes
- Number of HDDs supported
4
- TPM connector
yes
- PCI Express x1 (Gen 4.x) slots
1
- Supported memory clock speed (max)
8666 MHz
- EPS power connector (8-pin)
yes
- RAID support
yes
- Package weight
1.36 kg
- USB 3.2 Gen 1 (3.1 Gen 1) connectors
1
- Unbuffered memory
yes
- Number of storage drives supported
6
Documents & Downloads
User & Safety Instructions
User & Safety Instructions 3376556 Asus PRIME B860M-A-CSM Motherboard PC base #####Intel® 1851 Form factor (details) ATX Motherboard chipset Intel® B860
Description
The connectivity options are extensive with several USB ports, including USB 3.2 Gen 2 and USB-C 3.2 Gen 2x2, and ensure fast data transfer rates for external devices. The integration of advanced audio functions with high-definition audio (8-channel) provides for a rich sound experience. With RAID support for storage interfaces, including SATA-600 and PCIe options, users can enjoy flexibility in setup and enable efficient data management and redundancy solutions.
Robust performance
The Asus PRIME B860-PLUS-CSM is equipped with the Intel B860 chipset, which was developed for processing high performance tasks, making WAS an excellent choice for gamers and professionals.
Comprehensive connectivity
With a range of USB ports, including USB 3.2 ports and USB-C options, users benefit from an efficient data transfer that enables fast connections to external devices.
Advanced audio experience
With high definition audio capabilities and a 8 channel output, this motherboard delivers high sound quality to enhance the multimedia experience in games and entertainment.
Flexible storage solutions
The motherboard supports RAID configurations with multiple SATA and PCIe ports, providing options for data redundancy and improved performance that meet different storage requirements.
Intelligent cooling functions
Equipped with the Asus fan Xpert 2+ technology and a VRM heat sink design, the motherboard provides efficient heat management and thus optimizes the performance stability and durability.
This text is machine translated.
Features
- Ready for advanced AI PCs: Designed for the future of AI computing, with the power and connectivity required for demanding AI applications
- Intel LGA 1851 socket: Supports Intel core ultra processors (Series 2)
- Asus CSM Program: A stable motherboard supply, end-of-life notifications, and IT software for business boards
- Asus Control Center Express: Integrated IT monitoring and management software that simplifies enterprise-level system management
- Optimized thermal design: Massive heat sink with integrated I O cover, high-conductive heat conductive heat conductive pads
Scope of delivery
- 1 x M.2 Rubber pack
- M.2 Screw package
- ACC Express activation key card
- 2 x Serial ATA cable







