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Thermal Grizzly TG Minus Pad HC High compression Thermally conductive pad non-conductive 1 mm (L x W) 120 mm x 100 mm
EAN:
Part number:
Item no:
Product type
Thermally conductive pad
Material thickness
1 mm
Length
120 mm
Width
100 mm
Type
High compression
Highlights & Details
- Very high compressibility
- Very good thermal conductivity, even when strongly compressed
- Can be adapted in case of deviations in the installation height
- Electrically non-conductive
- Wide range of uses
- Easy to use
Technical specifications
- Product type
Thermally conductive pad
- Type
High compression
- Content
2 pc(s)
- Features
non-conductive
- Factory colour
Multicolour
- Material thickness
1 mm
- Dim
(L x W) 120 mm x 100 mm
- Length
120 mm
- Width
100 mm
- Wireless charging
No
- Weight
0
- UKCA
yes
Documents & Downloads
User & Safety Instructions
User & Safety Instructions 3489268 Thermal Grizzly TG Minus Pad HC High compression Thermally conductive pad non-conductive 1 mm (L x W) 120 mm x 100 mm
Description
The heat transfer pads of the Minus Pad High Compression series are particularly strong compressible with very high thermal conductivity. They are particularly handy in converting graphics cards to water coolers, since a size (thickness) of high compression pads can be used at different places.
The heat transfer pads of the TG Minus Pad High Compression series possess an especially high compressibility. This makes them very versatile in use, because different height differences can be bridged simultaneously with a pad. This is particularly useful in converting graphic cards with a GPU-water cooler or replacing the heat transfer pads of a graphics card cooler, as a TG Minus Pad High Compression (HC-Pad) can be used here on different components like VRAM, voltage transformers and other contact surfaces.
Generally the high-compression pads are suitable at all those places, where the exact thickness of the needed heat-conducting pads is not known. In this case, the thickness of the existing pads is measured and replaced by slightly thicker high compression pads. It is particularly noteworthy that the pads not only maintain their heat conductivity with high compression, but also that this increases with Hohem pressure.
This text is machine translated.
The heat transfer pads of the TG Minus Pad High Compression series possess an especially high compressibility. This makes them very versatile in use, because different height differences can be bridged simultaneously with a pad. This is particularly useful in converting graphic cards with a GPU-water cooler or replacing the heat transfer pads of a graphics card cooler, as a TG Minus Pad High Compression (HC-Pad) can be used here on different components like VRAM, voltage transformers and other contact surfaces.
Generally the high-compression pads are suitable at all those places, where the exact thickness of the needed heat-conducting pads is not known. In this case, the thickness of the existing pads is measured and replaced by slightly thicker high compression pads. It is particularly noteworthy that the pads not only maintain their heat conductivity with high compression, but also that this increases with Hohem pressure.
This text is machine translated.