Bungard 130306E50 Circuit Board Base Material Cu-coating (L x W) 100 mm x 60 mm Hard paper/single-sided/1 x 35 µm Cu

Bungard 130306E50 Circuit Board Base Material Cu-coating (L x W) 100 mm x 60 mm Hard paper/single-sided/1 x 35 µm Cu

The name Original Bungard stands for excellent quality and reliability of materials and equipment used in producing these circuit boards for prototypes and limited series production. The special quality requirements for photo-coated base materials can be judged from the following facts: The base material conforms to all international standards and approval ratings as summarised in the IPC 4101 A standard list. The photo lacquer is characterised by high detail rendering, sharp contrast and short processing times. It is wonderfully tolerant with regard to processing scope. Sufficient exposure is the only requirement to guarantee great results. The lacquer coat is absolutely dust-free and has straight edges. The photo lacquer is burnt in and artificially aged, which ensures a very long storage time of over 1 year. A label indicates the use by date. Processing progress is clearly shown by changes in colour during exposure and development. To distinguish them better, only original Bungard circuit boards have a special, blue-dyed light-protective film.

Highlights & Details

• RoHS compliant

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