Edsyn CR77 Solder paste Content 10 g
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Highlights & Details
EDSYN CR 77 solder paste with NO-CLEAN flux and tin-silver-copper
- Fine pitch SMD solder paste with 3 metals and NO-CLEAN flux
Technical specifications
- Product type
Solder paste
- Content
10 g
Documents & Downloads
Information
Information 2144496 Edsyn CR77 Solder paste Content 10 g
Security datasheet
Security datasheet 2144496 Edsyn CR77 Solder paste Content 10 g
Signal word
Attention
GHS / H Statements
- H 317: May cause an allergic skin reaction
- H 411: Toxic to aquatic life, with long-lasting effects
GHS / P Statements
- P 272: Contaminated clothing not to be worn outside workplace
- P 280: Wear protective gloves/protective clothing/eye protection/face protection
- P 333+313:SKIN IRRITATION/SKIN INFLAMMATION: Seek medical advice
Description
Solder pastes suitable for a wide range of surfaces and have a non-high melting point are one of the requirements made by the pcb processing industry and the repair companies. The SMD solder paste CR 77 is suitable for silver-treated surfaces as well as for copper-plated surfaces. The proven flux and the alloy of 3 metals enables an excellent application and melting behavior.
Due to industrial requirements, a lead-free SMD solder paste has been developed that meets the careful guidelines of the various standards and is suitable for good processing in the event of repairs. The flux composition corresponds to F-SW 32. The solder alloy itself is composed as follows: Sn96.5Ag3Cu0.5
Storage: The unopened container should be stored at a temperature of 20°C. When open, the maximum processing time depends on the environmental influences.
Instructions for use: Once the paste has been removed, the syringe must be closed as tightly as possible again. Used paste should not be stored in a container with the fresh to-seed. In the ongoing work process, these can of course be used together. However, different solder alloys and paste types must not be mixed.
Advantages: * NO CLEAN - Paste
Excellent contour stability
No formation of solder ball or splash
Long-term processing and long storage time possible
Ideal for fine pitch applications
Perfect results when used with hot air/soldering iron
Various sizes of conical dosing needles (option)
This text is machine translated.
Due to industrial requirements, a lead-free SMD solder paste has been developed that meets the careful guidelines of the various standards and is suitable for good processing in the event of repairs. The flux composition corresponds to F-SW 32. The solder alloy itself is composed as follows: Sn96.5Ag3Cu0.5
Storage: The unopened container should be stored at a temperature of 20°C. When open, the maximum processing time depends on the environmental influences.
Instructions for use: Once the paste has been removed, the syringe must be closed as tightly as possible again. Used paste should not be stored in a container with the fresh to-seed. In the ongoing work process, these can of course be used together. However, different solder alloys and paste types must not be mixed.
Advantages: * NO CLEAN - Paste
Excellent contour stability
No formation of solder ball or splash
Long-term processing and long storage time possible
Ideal for fine pitch applications
Perfect results when used with hot air/soldering iron
Various sizes of conical dosing needles (option)
This text is machine translated.