Edsyn SAC15250-3 Solder, lead-free

With continuous flux core, the NO-CLEAN solution, with flux, no need to clean the solder joints after soldering
Eutectic alloy prevents the so-called "sticking" of components
Halogen-free for reliable joints.
It is no longer necessary to clean the circuit boards
Ideal for use in SMD technology
Open copper pads can also be soldered without any hesitation
Low smoke development
Short wetting time
Easier to work because of the low formation of solder balls
Higher flux content helps to achieve fast soldering
Double the proportion of flux also helps with soldering with large oxide layers
3 metals Tin – Silver – Copper simplify lead-free working
Melting point:
Solidus 217°C
Liquidus: 217°C.

This text is machine translated.