HARTING 09691812550 09 69 181 2550 Solder contact AWG (min.): 24 AWG max.: 20 Copper alloy 10 A 1 pc(s) Piece
EAN:
Part number:
Item no:
Packaging type
Piece
Product type
Solder contact
AWG max.
20
Contact material
Copper alloy
Content
1 pc(s)
Datasheet (PDF)
Technical specifications
- Series D-Sub
- Contact description: Straight
- Connection type: Solder connection
- Rated current ≤ 10 A
- Constant resistance: 3 mΩ
- Temperature limit: -55 ... +125 °C
- Mating cycles ≥ 500
- Test voltage Ueff 4 kV @ 50 Hz
- Material contacts: Copper alloy
- Contact surface: Au over Ni
- Net weight: 0.5 g
- Layer thickness ≥ 50 µinch
- Designation: Mixed
- Rated voltage: 3,000 V
- Plug-in force ≤ 5 N
- Pull force ≈ 2.5 N
- Contact type: Solder contact
- Gender: Jack
- Production process: Turned contacts
- Conductor cross-section: AWG 24 ... AWG 20
- Stripped length: 1.5 mm
- Material locking: PI
- Material housing: Polycarbonate / Teflon (PTFE)
- Packaging type
Piece
- Product type
Solder contact
- AWG max.
20
- Contact material
Copper alloy
- Content
1 pc(s)
- AWG (min.)
24
- Connection
Soldering
- Mating cycles
500
- Manufacturer part #
09691812550
- Contact type
Machined contacts
- Contact surface
Gold plated
- Nominal current
10 A
- Type
09 69 181 2550
Bus
-55-125 °C
Other
Nickel/gold
1.5 mm
0.25-0.5 mm²
0.25-0.5 mm²
10 A
Other copper alloys
500
Turned (lathe)
Documents & Downloads
Datasheet
Datasheet 3002219 HARTING 09691812550 09 69 181 2550 Solder contact AWG (min.): 24 AWG max.: 20 Copper alloy 10 A 1 pc(s) Piece
Datasheet 3002219 HARTING 09691812550 09 69 181 2550 Solder contact AWG (min.): 24 AWG max.: 20 Copper alloy 10 A 1 pc(s) Piece
User & Safety Instructions
User & Safety Instructions 3002219 HARTING 09691812550 09 69 181 2550 Solder contact AWG (min.): 24 AWG max.: 20 Copper alloy 10 A 1 pc(s) Piece
Description
Solder contact, straight, operating current: 10 A, socket, copper alloy, Au over Ni, conductor cross-section: 0.25...0.5 mm², AWG 24 ... AWG 20
This text is machine translated.
This text is machine translated.