With continuous flux core, the NO-CLEAN solution, with fluxing agent according to F-SW 32 Also suitable for slightly soiled or oxidized pads Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 32 Flux residues are transparent Melting point: * Solidus: 227°C. Liquidus: 227°C.
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Features
250g coil
With a diameter
of 1.5mm
Description
With continuous flux core, the NO-CLEAN solution, with fluxing agent according to F-SW 32 Also suitable for slightly soiled or oxidized pads Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 32 Flux residues are transparent Melting point: * Solidus: 227°C. Liquidus: 227°C.