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Felder "Cu-Rophos 5" Solder Stick, Lead-free CuP 281 16 g 2 mm
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Technical specifications
- Lot : Cup 281 (DIN EN ISO 17672)
- Melting range : 645-815 °C.
- Operating temperature : Min. 710 °C
- Solder joints temperature resistant up to 200 °C.
- Low temperature stable up to -50 °C.
- Dim
- Weight
16 g
- Length
500 mm
- Alloy
CuP 281
- Type
Stick
Lead-free
- Wire diameter
2 mm
- Product type
Solder
Documents & Downloads
Information
Information 2226400 Felder "Cu-Rophos 5" Solder Stick, Lead-free CuP 281 16 g 2 mm
Security datasheet
Security datasheet 2226400 Felder "Cu-Rophos 5" Solder Stick, Lead-free CuP 281 16 g 2 mm
Signal word
GHS / EUH statements
- EUH 210: Safety data sheet available on request
Description
Phosphorous copper hard solder for flux-free soldering of copper pipes in oil, gas and liquefied gas installations as well as in the heating and drinking water installation via 28 x 1.5 mm pipe dimensions. Thanks to the silver content, it is best suited for applications in the cold climate area and in systems subject to vibration. Excellent flow properties, for copper to copper without additional flux, for soldering on brass and red cast, a hard solder flux ( Cu-Rosil® according to DIN EN 1045 – FH 10) must also be used. Suitable for soldering on gas and liquefied gas systems (operating temperatures from -50 to +150°C).
This text is machine translated.
This text is machine translated.