High-quality copper base in combination with heat-pipes in direct contact and efficient aluminum lamellas for optimum heat dissipation;4-pin PWM fan double ball-bearing
User & Safety Instructions 3818302 Dynatron CPU cooler + fan
Description
Powerful heat sink with active cooling for AmpeOne socket 5964 This cooling system is specially developed for the high thermal requirements of AmpeOne platforms in socket 5964 and is designed for use in tower PCs and comparable systems with sufficient height. The copper base absorbs the heat from the processor chip quickly and transfers it efficiently to the integrated heatpipe system. The heat pipes transport the heat reliably from the contact surface to the large-area aluminum fins. Through targeted active air flow (fan) the heat is continuously dissipated, so that a stable operating temperature is maintained even at very high power consumption. Up to 400W TDP and an ambient temperature of 41°C performance, reliability and extended system life are always guaranteed.
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Scope of delivery
With 6 bits. Heat conductive paste
Description
Powerful heat sink with active cooling for AmpeOne socket 5964 This cooling system is specially developed for the high thermal requirements of AmpeOne platforms in socket 5964 and is designed for use in tower PCs and comparable systems with sufficient height. The copper base absorbs the heat from the processor chip quickly and transfers it efficiently to the integrated heatpipe system. The heat pipes transport the heat reliably from the contact surface to the large-area aluminum fins. Through targeted active air flow (fan) the heat is continuously dissipated, so that a stable operating temperature is maintained even at very high power consumption. Up to 400W TDP and an ambient temperature of 41°C performance, reliability and extended system life are always guaranteed.