Buy Bopla BoVersa 48144303.HMT3 Industrial-grade casing (L x W x H) 216 x 120 x 55.5 mm Aluminium White 1 pc(s)

A rectangular white plastic enclosure with beveled edges, designed for housing electronic components, featuring a flat top and mounting brackets.

A white rectangular plastic enclosure with two halves open side by side, accompanied by screws and small circular caps for assembly.

1/2

Material

Aluminium

IP rating

IP66

IP68

Width

120 mm

Height

55.5 mm

Content

1 pc(s)

Datasheet (PDF)

Fast track dispatch on Fri, 11 Sep

2 Piece(s)

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Piece(s)

Total (€ 39.49 / piece)

€ 39.49

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Highlights & Details

BoVersa BOV-A KWL 171204-9003, set, 216 x 120 x 55.5mm, aluminum, white, similar RAL 9003

Protection class IP66 / 68 (1.2 m - 2 h)
Impact strength: IK08
Temperature resistance: -30°C to 100°C.
Colour white similar. RAL 9003
Made from aluminum alloy
Upper part with foil surface, lower part with cooling ribs and wall brackets

Technical specifications

Features: with bracket
with cooling fins

Material: Aluminium

: IP66
IP68

Factory colour: White

Type: Design-casing for electronic components with high mechanical load-carrying capacity

Length: 216 mm

Width: 120 mm

Height: 55.5 mm

Content: 1 pc(s)

Industrial packaging: Yes

Dim: (L x W x H) 216 x 120 x 55.5 mm

Type: BoVersa 48144303.HMT3

Weight: 240 g

Product type: Industrial-grade casing

Documents & Downloads

Datasheet

Datasheet 3720721 Bopla BoVersa 48144303.HMT3 Industrial-grade casing (L x W x H) 216 x 120 x 55.5 mm Aluminium White 1 pc(s)

User & Safety Instructions

User & Safety Instructions 3720721 Bopla BoVersa 48144303.HMT3 Industrial-grade casing (L x W x H) 216 x 120 x 55.5 mm Aluminium White 1 pc(s)

Description

The completely new and advanced housing concept, with modern design, offers flexible and customer-specific design options including lighting concept and forward-looking cooling for the version with aluminum base. The casing can be used for applications in the hand, on the table, at the wall or at the mast. The housing provides optimum conditions for, among other things, Internet of Things or Embedded systems.

This text is machine translated.