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Weidmüller Pin housing PCB Total number of pins 10 Contact spacing: 3.50 mm 1065330000 20 pc(s)

Product type
Pin housing PCB
Connector type
Plug, horizontal mount
No. of rows
1
CS
3.50 mm
Total number of pins
10
Datasheet (PDF)
EAN:
Part number:
Item no:
Unavailable

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Conrad ElectronicTerms & Conditions

Highlights & Details

PCB connector

  • Content: 20 pc(s)
  • No. of rows: 1
  • Total number of pins: 10

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Technical specifications

Product type

Pin housing PCB

Connector type

Plug, horizontal mount

No. of rows

1

Connector system

wire-to-board

Features

2-tier

CS

3.50 mm

Pins per row

10

Total number of pins

10

Width

35.00 mm

Nominal current

7 A

Nominal current - rounded value

7 A

Content

20 pc(s)

Dim

(L x W x H) 18.90 x 35.00 x 24.40 mm

Connection

Print

Manufacturer part #

1065330000

Factory colour

Black

Industrial packaging

Yes

Contact material

Cu-alloy, tin plated

Nominal voltage

150 V

Height

24.40 mm

Length

18.90 mm

RoHS-compliant

Yes

Connector orientation

Parallel (to the PCB)

Type

S2LD-THR 3.50/20/90G 3.2SN BK BX

UKCA

not relevant

Documents & Downloads

Datasheet

Datasheet 283285 Weidmüller Pin housing PCB Total number of pins 10 Contact spacing: 3.50 mm 1065330000 20 pc(s)

User & Safety Instructions

User & Safety Instructions 283285 Weidmüller Pin housing PCB Total number of pins 10 Contact spacing: 3.50 mm 1065330000 20 pc(s)

Description

PCB connector. Multi-pin connector on the side of open, reflow solder connection, 3.50 mm, number of poles: 20, 90°, solder pin length: 3.2 mm, tinned, black, Box. The new standard for packing density: The virtual grid 0,875 mm - for 1 mm² I/O connections. The only 4-row double level terminal strip for typical IP20-sensor interfaces in grid 3.5. The S2L in double pack - a standard exceeds itself: each 3.5mm width 4 I/O contacts for 1 mm² cross cable connection. high stability with a friction-type housing geometries. + solder sleeve saves screw mounting. Less is more - the essential advantages for your application: 75% less space on the board, less process costs through + solder sleeve, less mechanical load of the solder joints, more space, for example, for display in the front panel. A "smaller" contribution to more competitiveness: additional features with the same space or reduced dimensions of the device with the same scope of functions.

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