Edsyn SAC1250-3 Solder, lead-free

With continuous flux core, the NO-CLEAN solution, with flux, no need to clean the solder joints after soldering
* eutectic alloy prevents the so-called "sticking" of components
* halogen-free - thus high reliability of the solder joints
* no need to clean the circuit boards
* ideal for use in SMD technology
* Open copper pads can also be soldered without any hesitation
* low smoke development
* short wetting time
* easier to work, as there is little formation of lotus ball
* higher flux content helps to achieve fast soldering
* Double the proportion of flux also helps with soldering with large oxide layers
* 3 metals Tin – Silver – Copper simplify lead-free working
Melting point:
* Solidus: 217°C.
* Liquidus: 217°C.

This text is machine translated.