With continuous flux core, the NO-CLEAN solution, with flux, no need to clean the solder joints after soldering Halogen-free for reliable joints. It is no longer necessary to clean the circuit boards Ideal for use in SMD technology Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 34 Low smoke development Short wetting time Melting point: Solidus 227°C Liquidus: 227°C.
This text is machine translated.
Features
250g coil
With a diameter
of 0.5mm
Description
With continuous flux core, the NO-CLEAN solution, with flux, no need to clean the solder joints after soldering Halogen-free for reliable joints. It is no longer necessary to clean the circuit boards Ideal for use in SMD technology Copper content makes copper pads on the printed circuit board easier to process Sn99 Cu1 with F-SW 34 Low smoke development Short wetting time Melting point: Solidus 227°C Liquidus: 227°C.
This text is machine translated.
Features
250g coil
With a diameter
of 0.5mm
Accessories
(*All information is plus legal VAT)
The necessary accessories are required to use the article as described.