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Edsyn SSAC2010 Solder, lead-free

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Highlights & Details

EDSYN SSAC2010 fine pitch solder wire with tin-silver-copper

  • SN 96.5 AG Cu0.5 with F-SW32
  • A blue-bordered square with a white background, on which a grey exclamation mark is centred. Symbolises a warning.

Technical specifications

Product type

Solder, lead-free

Documents & Downloads

Information

Information 2144512 Edsyn SSAC2010 Solder, lead-free

Security datasheet

Security datasheet 2144512 Edsyn SSAC2010 Solder, lead-free

Signal word

Attention

GHS / H Statements

  • H 317: May cause an allergic skin reaction

GHS / P Statements

  • P 273: Avoid release into the environment

GHS / EUH statements

  • EUH 208: Contains a substance that may cause an allergic reaction

Description

Flux according to F-SW 32 - hardly visible, clear flux residues
It is no longer necessary to clean the circuit boards - NO - CLEAN
Eutectic solder, i.e. the solder is either in solid or liquid state, there is no broad transition state - no "glued" solder joints - particularly important for the smallest solder joints with a minimum solder volume
Ideal for use in SMD technology, especially the fine pitch components and micro components
SN 96.5 AG Cu0.5
Silver-plated alloy facilitates the soldering of SMDs and the finest compounds
Low smoke development
Lower repair soldering temperature compared to conventional lead-free soldering - easier to use for the user

This text is machine translated.

Features

  • 10g spool.
  • With a diameter
  • of 0.2 mm

Accessories

(*All information is plus legal VAT)

The necessary accessories are required to use the article as described.