EUH 208: Contains a substance that may cause an allergic reaction
Description
Flux according to F-SW 32 - hardly visible, clear flux residues It is no longer necessary to clean the circuit boards - NO - CLEAN Eutectic solder, i.e. the solder is either in solid or liquid state, there is no broad transition state - no "glued" solder joints - particularly important for the smallest solder joints with a minimum solder volume Ideal for use in SMD technology, especially the fine pitch components and micro components SN 96.5 AG Cu0.5 Silver-plated alloy facilitates the soldering of SMDs and the finest compounds Low smoke development Lower repair soldering temperature compared to conventional lead-free soldering - easier to use for the user
This text is machine translated.
Features
10g spool.
With a diameter
of 0.2 mm
Description
Flux according to F-SW 32 - hardly visible, clear flux residues It is no longer necessary to clean the circuit boards - NO - CLEAN Eutectic solder, i.e. the solder is either in solid or liquid state, there is no broad transition state - no "glued" solder joints - particularly important for the smallest solder joints with a minimum solder volume Ideal for use in SMD technology, especially the fine pitch components and micro components SN 96.5 AG Cu0.5 Silver-plated alloy facilitates the soldering of SMDs and the finest compounds Low smoke development Lower repair soldering temperature compared to conventional lead-free soldering - easier to use for the user
This text is machine translated.
Features
10g spool.
With a diameter
of 0.2 mm
Accessories
(*All information is plus legal VAT)
The necessary accessories are required to use the article as described.