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Edsyn SAC8250 Solder, lead-free
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Highlights & Details
- Sn95.5 AG Cu0.7 with F-SW 34
Technical specifications
- Product type
Solder, lead-free
Documents & Downloads
Information
Information 2144503 Edsyn SAC8250 Solder, lead-free
Security datasheet
Security datasheet 2144503 Edsyn SAC8250 Solder, lead-free
Signal word
GHS / P Statements
- P 273: Avoid release into the environment
Description
With continuous flux core, the NO-CLEAN solution, with flux, no need to clean the solder joints after soldering
Eutectic alloy prevents the so-called "sticking" of components
Halogen-free for reliable joints.
It is no longer necessary to clean the circuit boards
Ideal for use in SMD technology
Open copper pads can also be soldered without any hesitation
Low smoke development
Short wetting time
Easier to work because of the low formation of solder balls
3 metals Tin – Silver – Copper simplify lead-free working
Melting point: * Solidus: 217°C.
Liquidus: 217°C.
This text is machine translated.
Eutectic alloy prevents the so-called "sticking" of components
Halogen-free for reliable joints.
It is no longer necessary to clean the circuit boards
Ideal for use in SMD technology
Open copper pads can also be soldered without any hesitation
Low smoke development
Short wetting time
Easier to work because of the low formation of solder balls
3 metals Tin – Silver – Copper simplify lead-free working
Melting point: * Solidus: 217°C.
Liquidus: 217°C.
This text is machine translated.
Features
- 250g coil
- With a diameter
- of 0.8mm
Accessories
(*All information is plus legal VAT)The necessary accessories are required to use the article as described.
